In Pictures: Infineon ENDOPACK Cell embeds 1,200 V SiC MOSFETs directly in traction inverter PCBs

Infineon's ENDOPACK Cell embeds 1,200 V CoolSiC MOSFETs directly into traction inverter PCBs for electric vehicles.

Photo by Ayyeee Ayyeee on Pexels

The chip-embedding technology targets sub-2 nH inductance and roughly 99.5% efficiency in traction inverters.

Photo by Johannes Plenio on Pexels

Infineon says the automotive-qualified ENDOPACK Cell can deliver up to 7% range gains for EVs.

Photo by Pixabay on Pexels

Vehicles using the embedded SiC MOSFET technology are slated for mass production in 2027.

Photo by Kindel Media on Pexels

Embedding the 1,200 V CoolSiC MOSFETs inside the PCB reduces inductance compared with conventional packaging.

Photo by Jakub Pabis on Pexels

The traction inverter technology is aimed at improving efficiency and driving range in electric vehicles.

Photo by Diana ✨ on Pexels

Infineon's ENDOPACK Cell is automotive-qualified for use in electric vehicle traction systems.

Photo by HONG SON on Pexels

Directly embedding power chips in the PCB is central to Infineon's claimed efficiency and inductance improvements.

Photo by Nicolas Foster on Pexels

Infineon plans mass production of vehicles using the ENDOPACK Cell technology in 2027.

Photo by Arturo A on Pexels